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Vacuum chamber encapsulating compound automatic glue machine

FOB Port: Shenzhen
Lead Time: 20 - 30 days
HTS Code: 8422.30.29 00

Delivery term:The date of payment from buyers deliver within days

Price:
Negotiable
minimum:
Total supply:
Delivery term:
The date of payment from buyers deliver within days
seat:
Beijing
Validity to:
Long-term effective
Last update:
2017-08-09 07:10
Browse the number:
74

Company Profile

Shanghai UPG International Trading Co., Ltd: Contact:
szxlyele(Mr.); Email:; Telephone:
(86 21) 63173900 Ext:101; Area:
Beijing; Address:
Room 2403 Jincheng Mansion 511, Tianmuxi Road, Shanghai, Shanghai, China (200070); Website: http://szxlyele.ytconsan.com/

Product details

Model Number: xly-z50 Brand Name: xly Key Specifications/Special Features: Empty containers for electronics, electrical products, such as semiconductor, electronics, electrical components, wafer, chemical raw materials, vacuum storage, powder metallurgy, has moisture-proof, anti-oxidation discoloration function: has the very good application in the process of vacuum glue eliminating bubbles.Excellent characteristics:1. Easy to operate, good air tightness2. Beautiful appearance, simple structure3. Use watertight hinge and water tight hasp4. The vacuum can reach -0.1mpa.24 hours without leakage5. According to the different requirements of customers design and manufacture of stainless steel or carbon steel can be used Shipping Information: